High-speed CMOS Area Camera

High-speed CMOS Area Camera ・Image date and profile date can be acquired・With downloading itterassyaimase・High expandability・High-speed and compact 3D measurement
  • Features
  • Specifications

Image date and profile date can be acquired.

Data around the highest luminance within the designated area can be acquired.
The acquired data are utilized for 3D measurement processing by the optical-cross method.

With downloading itterassyaimase

FPGA image firmware parameters can be updated via serial communication of CameraLink.

High-speed and compact 3D measurement

A compact 3D measurement system can be materialized by incorporating this camera into our original unit. The 3D measurement is materialized even during high-speed transfer. Imaging can be conducted at the speed up to 1,000 mm/sec.

Product Specifications

Sensor type Monochrome CMOS
Shutter High-speed global shutter: 2 μsec (Min) to 500 msec (Max) (approx. 2 μsec increment)
Maximum pixel size 1,280 x 1,024 pixels
Frame rate 500 fps@1,280 x 1,024
Pixel size 12μm × 12μm
Image light-receiving unit 15.36mm × 12.29mm
Dynamic range 59 dB (10-bit equivalent)
ROI 2 areas can be created in the perpendicular direction.
CameraLink Base Configuration × 2ch
Lens mount C-mount/F-mount
Power supply DC12V to DC15V
Ambient temperature Power ON: 0 to 40 °C; Power OFF: - 10 to 50 °C (non condensing)
Ambient humidity Power ON: 30 to 80% RH (non condensing)
Power OFF: 10 to 90% RH (non condensing)
External dimensions 74 mm x 74 mm x 88.2 mm (F-mount)
74 mm x 74 mm x 59.6 mm(C-mount)
Peripheral devices I/O: 4 inputs and 4 outputs. An inspection system can be constructed with this camera alone.
CameraLink: Can simultaneously output profile and image data.
USB: Controllable at High Speed (optional)
Weight Approx. 385 g
Applicable standard CE Mark certified