Our Products / Contracted Development

Contracted Development

Tray-type Chip Component Visual Inspection System CCVIS-PL

Tray-type Chip Component Visual Inspection System CCVIS-PL
  • Features
  • Specifications

Image processing technology

High-precision image processing system with simultaneous acquisition of 4 images

Example: Chip on body edge

  • Upper level Blue (B) light Effective to detect fissure, crack, 
or dent on the body
  • Middle level Green (G) light Effective to detect chip on the body edge or discontinued
  • Lower level Red (R) light Effective to detect internal crack or discoloration on the leading edge of the electrode
  • Vertical (I) image Effective to detect stripped electrode

Our proposal to comply with customers’demands

We can offer the optimum system for the trays used at the customer’s factory.

System Outline

Feeding/collecting subsystem: Automatically feeds and collects up to 30 trays per set.
The subsystem automatically feeds and collects up to 30 trays per set.
Transfer subsystem: Stable transfer and high-speed processing
The transfer subsystem is designed to feed chip components by suction with the dedicated nozzles, thus causing no damage to workpieces and not affecting the inspection process. Pallet transfer and dual-line transfer by a biaxial robot contributes to high-speed processing.
Inspection subsystem: Conducts double-side inspection.Rejection subsystem: Rejects defective components by high-speed air valve.
Rejection by high-speed air valve has been attained based on the rejection technology of 7,000 pcs/min obtained during the development of CCVIS-A5.
Position correction subsystem: Reliable workpiece collection and easy operation
Workpieces are collected with high reliability thanks to a newly-introduced position correction mechanism while the operation is fairly easy.
Collection subsystem: Collects defective components by type.
The subsystem collects defective components by type and has no change-over or consumable parts.
Easy to operate
No change-over is required, and inspection parameters can easily be set.
System dimensions
Applicable tray
  • Tray
Applicable workpiece size (mm) (the past record)
Inspection item
Length, width, color, and area
Defects to be inspected
Dirt, foreign matter, nick, chip, break, discoloration, exposed electrode, etc.
Missing, discoloration, nick, larger, smaller
or stripped electrode

Inspection example

  • dark
  • conorUp
  • conorBottom
  • Dislocated cut No dislocation
  • Crack
  • Extensiveelectrode drip
  • Chipped edge
  • mark
  • Irregular projection
  • Crack/chip

System Outline (top view)

Positioning Camera 2 Back inspection Suctionnozzle Camera 1Back inspection Camera 3Rejection Rejection Camera 4 Collection Feeding

Defective workpiece judgment

  • R image
  • Image for judgment Crack
  • G image
  • Image for judgment Dirt
  • B image
  • Image for judgment Nick